HP Intel Xeon Platinum 8180 processor 2.5 GHz 38.5 MB L3
- Intel® Xeon® Platinum 8180 2.5 GHz
- 38.5 MB L3 LGA 3647 (Socket P)
- Processor cores: 28 14 nm 64-bit 205 W
- Maximum internal memory supported by processor: 768 GB DDR4-SDRAM
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Processor |
Processor codename |
Skylake |
Stepping |
H0 |
Thermal Design Power (TDP) |
205 W |
Processor cache type |
L3 |
Processor cache |
38.5 MB |
Processor boost frequency |
3.8 GHz |
Processor operating modes |
64-bit |
Processor threads |
56 |
Processor series |
Intel Xeon Platinum 8000 Series |
Component for |
Server/workstation |
Cooler included |
No |
Processor lithography |
14 nm |
Processor socket |
LGA 3647 (Socket P) |
Processor cores |
28 |
Processor base frequency |
2.5 GHz |
Processor model |
8180 |
Processor generation |
1st Generation Intel® Xeon® Scalable |
Processor family |
Intel® Xeon® Platinum |
Memory |
ECC |
Yes |
Memory channels |
Hexa-channel |
Memory clock speeds supported by processor |
2666 MHz |
Memory types supported by processor |
DDR4-SDRAM |
Maximum internal memory supported by processor |
768 GB |
Graphics |
On-board graphics card |
No |
Features |
HP segment |
Business |
Scalability |
S8S |
Embedded options available |
No |
Supported instruction sets |
AVX, AVX 2.0, AVX-512, SSE4.2 |
PCI Express slots version |
3.0 |
Maximum number of PCI Express lanes |
48 |
Market segment |
Server |
Execute Disable Bit |
Yes |
Processor special features |
Intel VT-x with Extended Page Tables (EPT) |
Yes |
Intel 64 |
Yes |
Intel Virtualization Technology (VT-x) |
Yes |
Intel Virtualization Technology for Directed I/O (VT-d) |
Yes |
Intel TSX-NI |
Yes |
Intel Turbo Boost Max Technology 3.0 |
No |
Intel® Optane™ Memory Ready |
No |
Intel® vPro™ Platform Eligibility |
Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) |
Yes |
Intel® Turbo Boost Technology |
2.0 |
Intel® AES New Instructions (Intel® AES-NI) |
Yes |
Intel Trusted Execution Technology |
Yes |
Intel® Speed Shift Technology |
Yes |
Enhanced Intel SpeedStep Technology |
Yes |
Operational conditions |
Tcase |
84 °C |
Packaging data |
Package height |
156 mm |
Package depth |
203 mm |
Package width |
399 mm |
Other features |
Compatibility |
Z8G4 |