Transcend MTE662T2 2 TB M.2 PCI Express 3.0 NVMe 3D NAND
- DRAM Cache embedded
- 30µ” PCB gold finger
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- PCIe Gen 3 x4 interface
- Key components fortified by default with Corner Bond technology
- Compliant with PCI Express specification 3.1
- Compliant with NVM Express specification 1.3
- Supports NVM command
- SLC caching technology
- Built-in LDPC ECC (Error Correction Code) functionality
Transcend’s MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ” gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃.
Features |
TBW rating |
4400 |
Mean time between failures (MTBF) |
3000000 h |
Random write (4KB) |
355000 IOPS |
Random read (4KB) |
340000 IOPS |
Write speed |
2700 MB/s |
Read speed |
3500 MB/s |
Memory type |
3D NAND |
NVMe |
Yes |
Interface |
PCI Express 3.0 |
SSD form factor |
M.2 |
SSD capacity |
2 TB |
Power |
Power consumption (sleep) |
1 W |
Power consumption (read) |
6.9 W |
Operating voltage |
3.3 V |
Weight & dimensions |
Weight |
9 g |
Height |
3.58 mm |
Depth |
22 mm |
Width |
80 mm |
Operational conditions |
Storage temperature (T-T) |
-55 – 85 °C |
Operating temperature (T-T) |
-20 – 75 °C |